Silicone Gel Low Modulus And Good Flexibility Sealant

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Product Details
Customization: Available
Application: Construction
Bonding Function: Instant Adhesive
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  • Silicone Gel Low Modulus And Good Flexibility Sealant
  • Silicone Gel Low Modulus And Good Flexibility Sealant
  • Silicone Gel Low Modulus And Good Flexibility Sealant
  • Silicone Gel Low Modulus And Good Flexibility Sealant
  • Silicone Gel Low Modulus And Good Flexibility Sealant
  • Silicone Gel Low Modulus And Good Flexibility Sealant
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  • Overview
  • Product Description
  • Application
  • Our Advantages
  • Product Parameters
Overview

Basic Info.

Model NO.
HM-SS7460
Color
Black
Composition
Organic Material
Morphology
Solvent
Material
Silicone
Classification
Room Curing
Main Agent Composition
Rubber
Characteristic
Weatherability
Promoter Composition
Curing Agent
CAS No.
N/A
Formula
N/A
EINECS
N/A
Transport Package
Box
Specification
N/A
Trademark
Howell
Origin
China
HS Code
3506100010
Production Capacity
100000

Packaging & Delivery

Package Size
20.00cm * 20.00cm * 20.00cm
Package Gross Weight
2.000kg

Product Description


Silicone Gel Low Modulus And Good Flexibility Sealant

Product Description

SS7460, two-component silicone gel. It can be cured at room temperature or quickly cured by heating. The cured product has excellent insulation and weather resistance. After curing, the soft gel has low modulus and good flexibility. It not only retains the low stress relief and self-healing properties of liquid materials, but also provides dimensionally stable elastomer characteristics, which is very suitable for managing the CTE difference between electronic component materials. It could provide stress relief of PCB protection under thermal stress and mechanical stress. The gel has excellent reworkability, which can be easily removed or reworked for a specific component, and it can conveniently repair the integrity of the coating on the damaged part. Gel products can exhibit material performance stability at temperatures as low as -80°C, enabling PCB system components to operate reliably under these extreme temperatures.

Application

Coating/potting protection for power supply and PCB system components
 

Our Advantages

Curing at room temperature, fast curing under heating
Excellent process performanc
Low modulus, excellent stress adaptability, easy to rework
Excellent water resistance, weather resistance and chemical resistance

Product Parameters

Properties before curing

Basic material Polysiloxane
Color
 
Part A Blue
Part B Colorless and transparent
After Mixing Blue
Viscosity (mPa·s@23ºC) Part A 1000
Part B 1000
After Mixing 1000
Specific gravity after mixing 0.97
Working time(min) 5
Gel time(min) 20
Recommended curing conditions 60min@60ºC
 
4h@23ºC
**Curing instructions: The curing speed varies with the temperature and the thickness of the adhesive layer.
Properties after curing
Penetration (150g full cone) (1/10mm) 236
Breakdown voltage (kV/mm) 15
Volume resistivity (Ω•cm) 2.9×1014
Operating temperature (ºC) -80~210

**The test samples are cured at 60°C for 60 minutes, and the test temperature is 23ºC.

 

Silicone Gel Low Modulus And Good Flexibility SealantSilicone Gel Low Modulus And Good Flexibility SealantSilicone Gel Low Modulus And Good Flexibility SealantSilicone Gel Low Modulus And Good Flexibility Sealant
 

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