| Customization: | Available |
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| Bonding Function: | Structural Adhesive |
| Morphology: | Solid-State |
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CC9900-150D is a one-component conformal coating product with UV/moisture dual curing. It is suitable for a variety of coating methods. After curing, it forms a dense protection on the surface of printed circuit boards (PCB circuit boards), electronic components, integrated circuits, etc. Film to protect various electronic components and solder joints. This product has 100% solid content and meets national environmental protection requirements. Can be returned for repair.
Adhesive liquid properties before curing| Basic raw material | polyurethane acrylate |
| Color | colorless to light yellow |
| Viscosity (mPa·s) | 150 |
| Specific gravity (@23ºC) | 1.05 |
| Surface dry energy (mJ/cm2) | 1500 |
| Total solid energy (mJ/cm2) | 2000 |
| Hardness (Shore A) | 55 |
| Adhesion (level) | 0 |
| Tensile strength (MPa) | 2.56 |
| Elongation at break (%) | 75 |
| Volume resistivity (ohm-cm) | 5.3×1014 |
| Dielectric constant (1MHz) | 3.2 |
| Dielectric strength (KV/mm) | 23 |
| Surface resistance (ohm) | 4.9×1014 |
| Flame retardancy | UL94-V0 |
| Medium pressure resistance | passed |
| Water absorption rate (%)-2h boiling water | 1.5 |
| Tg(ºC) | 32 |
1kg
1. The product is sensitive to light/moisture. During storage and operation, it needs to be kept in a dry environment and sealed and the exposure to various light sources such as sunlight, UV light and other artificial lighting sources must be controlled;
2. When using, it is recommended to clean the surface of the coated product to remove surface impurities, oil stains and other pollutants to obtain the expected coating effect; manual brushing, mechanical spraying and other coating methods can be used;
3. Curing: It needs to be irradiated with ultraviolet light or visible light that reaches the glue layer and has an appropriate wavelength. The time is determined by the intensity and light distance of the lamp. Generally, the illumination time is six times the fixed time;
4. When bonding some materials that are particularly sensitive to temperature, the materials need to be cooled before use;
5. The uncured adhesive can be removed with appropriate organic solvents such as IPA, MEK, etc.;
Nanjing Howell New Material Technology Co., Ltd.
Room 501, Unit 7, Xingzhihui, Xinghuo Rd 19th, Jiangbei New District, Nanjing, (210000), Jiangsu, China.
American Warehouse:Add: 1006 CROCKER RD, DOOR E5, WESTLAKE, OH 44145
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